Strategic Entry into Semiconductor Sector
Paras Defence and Space Technologies Ltd. announced Monday the establishment of Paras Semiconductor Pvt. Ltd., a new subsidiary marking its entry into the high-stakes semiconductor arena. This strategic move centers on developing advanced packaging technologies crucial for defence and strategic electronics.
Advanced Packaging and OSAT Facility
The subsidiary will concentrate on advanced semiconductor packaging, including heterogeneous and 3D packaging. It plans to set up an Outsourced Semiconductor Assembly and Testing (OSAT) facility, a critical component in the global chip supply chain. This capability is slated to support semiconductor devices for optical and optronic systems used in defence and security, alongside applications in high-performance computing (HPC), networking, and data centres.
Aligning with National Goals
This initiative signifies Paras Defence's intent to participate in India's expanding semiconductor applications, particularly within the defence ecosystem. The focus on chiplet integration and advanced system-in-package (SiP) technologies aligns directly with the nation's drive towards self-reliance and building a resilient domestic semiconductor ecosystem. Munjal Sharad Shah, Managing Director, highlighted the strategic importance of semiconductors for national security, emphasizing advanced packaging's role in performance and supply chain control.
Robust Financial Backing
The proposed subsidiary, "Paras Semiconductors Private Limited," will have an authorised share capital of ₹10 lakh. Paras Defence will subscribe to 70,000 equity shares, representing a 70% stake. This diversification occurs against a backdrop of strong financial performance; the parent company recently reported a 50% year-on-year surge in net profit to ₹21 crore and a 21.8% rise in revenue to ₹106 crore for the second quarter.